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Introduction to SONY’s New Global Shutter CMOS Image Sensor 2019-11-06

SONY has announced that it will release six new stacked CMOS image sensors with global shutter function. The new sensors are based on a back-lit pixel structure and is suitable for industrial hardware applications. In addition to their compact size, the powerful imaging capabilities of these new sensors will ensure that is no deformation when filming moving objects. All will be based on SONY’s Pregius S stacked CMOS image sensor technology and have the global shutter functionality.

Continued advances in factory and logistics automation mean that machine vision cameras are now playing an increasingly important role. The new SONY image sensor architecture maintains the same level of imaging performance even as the sensor itself becomes more compact. The outstanding imaging performance together with faster, more accurate identification/measurement of these image sensors will provide an effective boost to productivity.

Key image sensor features:

1. The CMOS image sensor with global shutter functionality is more compact in size and delivers greater image clarity.
The new image sensors offer smaller size, high clarity and a stacked structure. The back-illuminated pixel structure makes the global shutter function possible and eliminates distortion when filming moving objects. High sensitivity and saturation remain unchanged even as the size of individual pixels are now 2.74 um2, or just 63% the size of conventional image sensors. Resolution is approximately 1.7 times greater than existing optical systems of the same size. Packaging has been reduced as well so that it is just 91% the size of the previous sensor.

2. High-speed read/write of video data

The back-illuminated pixel architecture offers greater flexibility on wiring layout. When the SLVS-EC high-speed interface standard developed by SONY is taken into account the video read/write rate is 2.4 times faster than the previous generation of image sensors. The extensive SONY product line-up consists not only of the IMX540/541/542 models that support the 5G bps standard. The high-speed IMX530/531/532 models are also available for high-end cameras that make use of high-speed bandwidth. USB 3.0 and 5GigE can therefore be applied in even more areas. All of these products will give a major boost to productivity by reducing the amount of time needed by applications during inspections, image recognition, label measurement and inspection process.


3. Enhanced functionality and reliability
Different signal processing circuits can be installed on the stacked structure to create an image CMOS image sensor that is both compact and powerful. When the signal circuitry follows a stacked layout, more functions can be packed into a packaging that is even smaller than the previous generation of image sensors. These include optimization of image data by mining the required data (ROI, self-trigger), using a dual A/D converter to provide internal HDR and prevent video blurring when videoing moving objects, and new functions such as short exposure management. The machine vision applications of different robots can then be satisfied.


CMOS image sensor key features::

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